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How we support the SWAP Hub
The ASU Core Research Facilities is equipped with state-of-the-art facilities, advanced equipment capabilities and staffed with experienced personnel, supporting a wide range of industries.
Our Advanced Electronics and Photonics Core, located at the MacroTechnology Works in the ASU Research Park, specializes on semiconductor and microelectronics research, development and fabrication. The Core regularly partners with the Southwest Advanced Prototyping (SWAP) Hub to advance the Hub's initiatives.
This integration will enable satellites to detect objects that are currently too faint or fast for existing systems. The project focuses on developing analog in-memory computing (AIMC) using radiation-resistant resistive memory (ReRAM) arrays, targeting energy efficiencies exceeding 10 tera operations per second per watt (TOPS/W) in extreme environments.
Marinella says “Ultimately this technology will enable demonstration of a radiation hard spaceborne remote sensing systems capable observing phenomena that are currently hidden.”
The Multi-MHz, High-Density, Ultra-Fast RADAR Power Converter project aims to advance radar power systems for critical defense applications. This project will develop a multi-megahertz, multi-kilowatt, high-density radar power converter that serves as the core of advanced radar systems. Using GaN-based switching devices, the converters are expected to achieve six times higher power density, 50% lower losses and ultra-fast response times.
Raja Ayyanar, leader of the project and a professor at the ASU School of Electrical, Computer and Energy Engineering, said “this project has potential to enable increased system power within pre-allocated volume and weight constraints, increasing mission capability."
The Advanced Electronics and Photonics Core supports this work withspecialized equipment, including tools to analyze material properties such as carrier concentration and mobility through Hall effect measurements up to 500°C. The Core also offers automated high-voltage, high-current I-V and C-V measurements using a FormFactor probe station, accommodating sample sizes from small pieces to 300 mm wafers. Another FormFactor probe station supports automated on-wafer RF measurements and small-signal parameter extraction up to 110 GHz.
SHIELD USA, a collaboration led by ASU and Deca Technologies, is advancing the CHIPS and Science Act’s goal of restoring U.S. semiconductor leadership and strengthening national security. Funded with $100 million over five years through the National Advanced Packaging Manufacturing Program, SHIELD USA focuses on developing next-generation microelectronics packaging technologies, particularly molded core organic substrates, through research, testing and qualification of new materials, processes and equipment.
ASU’s Advanced Electronics and Photonics Core Facility plays a key role in advancing SHIELD USA’s commercial viability, supporting 300 mm wafer-level and 600 mm panel-level manufacturing.
Beyond technology development, SHIELD USA is also investing in education, training and workforce development to build the talent needed for a sustainable domestic microelectronics ecosystem.
The Ultrafast Laser Facility Supports Semiconductor Research
The Ultrafast Laser Facility’s advanced methodologies, including pump-probe spectroscopy and time-resolved fluorescence measurements, allow for precise characterization of carrier dynamics, carrier lifetimes and thermalization processes in semiconductors. These techniques are also valuable for assessing the thermal stability of microelectronic materials.
By using our ultrafast laser capabilities, semiconductor researchers and companies can optimize device efficiency, identify material defects and accelerate the development of next-generation materials. These techniques are critical for advancing microelectronics, including solar cells, LEDs, transistors and photonics.
Upscaling metal halide perovskites (MHPs) is challenging due to mechanical film stresses that accelerate degradation and cause delamination or fracture. This study demonstrates that open-air blade coating with polymer additives like gellan gum and corn starch introduces beneficial compression, improving MHP film stability and optoelectronic properties.
Introduction
Perovskite semiconductors are promising for solar cells due to their defect tolerance and high carrier mobility but they face challenges from environmental and mechanical instability. Residual tensile stress can increase defect density, reduce carrier mobility and cause cracking, leading to structural breakdown and reduced efficiency.
Conclusion
Blade coating with polymer additives introduces beneficial compressive stress in perovskite films, improving crystallization, film quality and operational stability. This compressive stress enhances resistance to heat, humidity and thermal cycling while reducing cracking and delamination. The findings highlight stress relaxation as a key factor in perovskite degradation.
